产品展厅
Vespel CR-3200 PI DuPont 杜邦
- 品牌:DuPont 杜邦
- 型号:板、棒、管、方块、长条、圆盘、环、圆球和定制机加工制件
- 价格: ¥13.7/千克
- 发布日期: 2024-08-09
- 更新日期: 2024-12-26
产品详请
品牌 | DuPont 杜邦 |
货号 | |
用途 | Vespel? CR 系列在炼油厂或化学加工中具有出色的耐化学性。 它们为密封件提供高抗蠕变性,为泵的耐磨环提供干运行能力,并为球阀座等公差严格的部件提供易于加工的加工性。 |
牌号 | Vespel CR-3200 |
型号 | Vespel CR-3200 |
品名 | 聚酰亚胺类 |
包装规格 | 板、棒、管、方块、长条、圆盘、环、圆球和定制机加工制件 |
外形尺寸 | 板、棒、管、方块、长条、圆盘、环、圆球和定制机加工制件 |
生产企业 | DuPont 杜邦 |
是否进口 |
Vespel 是杜邦公司生产的一系列耐用高性能聚酰亚胺基塑料的商标。
特点和应用
Vespel 主要用于航空航天、半导体和运输技术。它结合了耐热性、润滑性、尺寸稳定性、耐化学性和抗蠕变性,可用于恶劣和 的环境条件。
与大多数塑料不同,即使在高温下也不会产生明显的释气,这使得它可用于轻质隔热罩和坩埚支撑。它在真空应用中也表现良好,低至极低的低温。然而,Vespel 往往会吸收少量的水,从而导致放置在真空中的泵时间更长。
尽管在这些特性中,有些聚合物都超过了聚酰亚胺,但它们的结合是 Vespel 的主要优势。
热物理性质
Vespel 通常用作测试热绝缘体的导热性参考材料,因为它具有高再现性和热物理性能的一致性。例如,它可以承受高达 300 °C 的反复加热,而不会改变其热性能和机械性能。已经发布了大量测量的热扩散率、比热容和推导密度的表格,这些表格都是温度的函数。
磁性
Vespel 用于 NMR 波谱的高分辨率探针,因为它的体积磁化率(Vespel SP-1 在 21.8 °C 时为 -9.02 ± 0.25×10?6[5])接近室温下的水(20 °C 时为 -9.03×10?6 [6]) 负值表示两种物质都是抗磁性的.将NMR样品周围材料的体积磁化率与溶剂的体积磁化率相匹配,可以减少磁共振线的磁化率展宽。
制造应用加工
Vespel 可以通过直接成型 (DF) 和等静压成型(基本形状 - 板材、棒材和管材)进行加工。对于原型数量,通常使用基本形状以提高成本效益,因为 DF 零件的工具成本相当高。对于大规模的CNC生产,DF零件通常用于降低每个零件的成本,而牺牲的材料性能不如等静压生产的基本形状。
类型
对于不同的应用,特殊配方被混合/复合。形状由三个标准过程生成:
压缩成型(用于板材和环);
等静压成型(棒材用);和
直接成型(用于大批量生产的小尺寸零件)。
与从压缩成型或等静压形状加工而成的零件相比,直接成型零件的性能特征较低。等静压形状具有各向同性的物理性质,而直接成型和压缩成型的形状表现出各向异性的物理性质。
Vespel is the trademark of a range of durable high-performance polyimide-based plastics made by DuPont.[1][2]
Characteristics and applications
[edit]
Vespel is mostly used in aerospace, semiconductor, and transportation technology. It combines heat resistance, lubricity, dimensional stability, chemical resistance, and creep resistance, and can be used in hostile and extreme environmental conditions.
Unlike most plastics,[3] it does not produce significant outgassing even at high temperatures, which makes it useful for lightweight heat shields and crucible support. It also performs well in vacuum applications,[4] down to extremely low cryogenic temperatures. However, Vespel tends to absorb a small amount of water, resulting in longer pump time while placed in a vacuum.
Although there are polymers surpassing polyimide in each of these properties, the combination of them is the main advantage of Vespel.
Thermophysical properties
[edit]
Vespel is commonly used as a thermal conductivity reference material for testing thermal insulators, because of high reproducibility and consistency of its thermophysical properties. For example, it can withstand repeated heating up to 300 °C without altering its thermal and mechanical properties.[citation needed] Extensive tables of measured thermal diffusivity, specific heat capacity, and derived density, all as functions of temperature, have been published.[citation needed]
Magnetic properties
[edit]
Vespel is used in high-resolution probes for NMR spectroscopy because its volume magnetic susceptibility (?9.02 ± 0.25×10?6 for Vespel SP-1 at 21.8 °C[5]) is close to that of water at room temperature (?9.03×10?6 at 20 °C [6]) Negative values indicate that both substances are diamagnetic. Matching volume magnetic susceptibilities of materials surrounding NMR sample to that of the solvent can reduce susceptibility broadening of magnetic resonance lines.
Processing for manufacturing applications
[edit]
Vespel can be processed by direct forming (DF) and isostatic molding (basic shapes – plates, rods and tubes). For prototype quantities, basic shapes are typically used for cost efficiency since tooling is quite expensive for DF parts. For large scale CNC production, DF parts are often used to reduce per part costs, at the expense of material properties which are inferior to those of isostatically produced basic shapes.[7]
Types
[edit]
For different applications, special formulations are blended/compounded. Shapes are produced by three standard processes:
compression molding (for plates and rings);
isostatic molding (for rods); and
direct forming (for small size parts produced in large volumes).
Direct-formed parts have lower performance characteristics than parts that have been machined from compression-molded or isostatic shapes. Isostatic shapes have isotropic physical properties, whereas direct formed and compression molded shapes exhibit anisotropic physical properties.
Some examples of standard polyimide compounds are:
SP-1 virgin polyimideprovides operating temperatures from cryogenic to 300 °C (570 °F), high plasma resistance, as well as a UL rating for minimal electrical and thermal conductivity. This is the unfilled base polyimide resin. It also provides high physical strength and maximal elongation, and the best electrical and thermal insulation values. Example: Vespel SP-1.15% graphite by weight, SP-21added to the base resin for increased wear resistance and reduced friction in applications such as plain bearings, thrust washers, seal rings, slide blocks and other wear applications. This compound has the best mechanical properties of the graphite-filled grades, but lower than the virgin grade. Example: Vespel SP-21.40% graphite by weight, SP-22for enhanced wear resistance, lower friction, improved dimensional stability (low coefficient of thermal expansion), and stability against oxidation. Example: Vespel SP-22.10% PTFE and 15% graphite by weight, SP-211added to the base resin for the lowest coefficient of friction over a wide range of operating conditions. It also has excellent wear resistance up to 149 °C (300 °F). Typical applications include sliding or linear bearings as well as many wear and friction uses listed above. Example: Vespel SP-211.15% moly-filled (molybdenum disulfide solid lubricant), SP-3for wear and friction resistance in vacuum and other moisture-free environments where graphite actually becomes abrasive. Typical applications include seals, plain bearings, gears, and other wear surfaces in outer space, ultra-high vacuum or dry gas applications. Example: Vespel SP-3.
Material properties data
[edit]
Material properties of Vespel[8] (produced by isostatic molding and machining)
Property Units Test
condition SP-1
(unfilled) SP-21
(15% graphite) SP-22
(40% graphite) SP-211
(10% PTFE,
15% graphite) SP-3
(15% MoS
2)
Specific gravity dimensionless 1.43 1.51 1.65 1.55 1.60
Thermal expansion
coefficient 10?6/K 211–296 K 45 34 27 [9]
296–573 K 54 49 38 54 52
Thermal conductivity W/mK at 313 K 0.35 0.87 1.73 0.76 0.47
Volume resistivity Ω·m at 296 K 1014–1015 1012–1013
Dielectric constant dimensionless at 100 Hz 3.62 13.53
at 10 kHz 3.64 13.28
at 1 MHz 3.55 13.87
温度、高摩擦和重负荷?自 1965 年以来,在恶劣的条件下,Vespel® 的性能表现优于其他工程材料。
特点和应用
Vespel 主要用于航空航天、半导体和运输技术。它结合了耐热性、润滑性、尺寸稳定性、耐化学性和抗蠕变性,可用于恶劣和 的环境条件。
与大多数塑料不同,即使在高温下也不会产生明显的释气,这使得它可用于轻质隔热罩和坩埚支撑。它在真空应用中也表现良好,低至极低的低温。然而,Vespel 往往会吸收少量的水,从而导致放置在真空中的泵时间更长。
尽管在这些特性中,有些聚合物都超过了聚酰亚胺,但它们的结合是 Vespel 的主要优势。
热物理性质
Vespel 通常用作测试热绝缘体的导热性参考材料,因为它具有高再现性和热物理性能的一致性。例如,它可以承受高达 300 °C 的反复加热,而不会改变其热性能和机械性能。已经发布了大量测量的热扩散率、比热容和推导密度的表格,这些表格都是温度的函数。
磁性
Vespel 用于 NMR 波谱的高分辨率探针,因为它的体积磁化率(Vespel SP-1 在 21.8 °C 时为 -9.02 ± 0.25×10?6[5])接近室温下的水(20 °C 时为 -9.03×10?6 [6]) 负值表示两种物质都是抗磁性的.将NMR样品周围材料的体积磁化率与溶剂的体积磁化率相匹配,可以减少磁共振线的磁化率展宽。
制造应用加工
Vespel 可以通过直接成型 (DF) 和等静压成型(基本形状 - 板材、棒材和管材)进行加工。对于原型数量,通常使用基本形状以提高成本效益,因为 DF 零件的工具成本相当高。对于大规模的CNC生产,DF零件通常用于降低每个零件的成本,而牺牲的材料性能不如等静压生产的基本形状。
类型
对于不同的应用,特殊配方被混合/复合。形状由三个标准过程生成:
压缩成型(用于板材和环);
等静压成型(棒材用);和
直接成型(用于大批量生产的小尺寸零件)。
与从压缩成型或等静压形状加工而成的零件相比,直接成型零件的性能特征较低。等静压形状具有各向同性的物理性质,而直接成型和压缩成型的形状表现出各向异性的物理性质。
Vespel is the trademark of a range of durable high-performance polyimide-based plastics made by DuPont.[1][2]
Characteristics and applications
[edit]
Vespel is mostly used in aerospace, semiconductor, and transportation technology. It combines heat resistance, lubricity, dimensional stability, chemical resistance, and creep resistance, and can be used in hostile and extreme environmental conditions.
Unlike most plastics,[3] it does not produce significant outgassing even at high temperatures, which makes it useful for lightweight heat shields and crucible support. It also performs well in vacuum applications,[4] down to extremely low cryogenic temperatures. However, Vespel tends to absorb a small amount of water, resulting in longer pump time while placed in a vacuum.
Although there are polymers surpassing polyimide in each of these properties, the combination of them is the main advantage of Vespel.
Thermophysical properties
[edit]
Vespel is commonly used as a thermal conductivity reference material for testing thermal insulators, because of high reproducibility and consistency of its thermophysical properties. For example, it can withstand repeated heating up to 300 °C without altering its thermal and mechanical properties.[citation needed] Extensive tables of measured thermal diffusivity, specific heat capacity, and derived density, all as functions of temperature, have been published.[citation needed]
Magnetic properties
[edit]
Vespel is used in high-resolution probes for NMR spectroscopy because its volume magnetic susceptibility (?9.02 ± 0.25×10?6 for Vespel SP-1 at 21.8 °C[5]) is close to that of water at room temperature (?9.03×10?6 at 20 °C [6]) Negative values indicate that both substances are diamagnetic. Matching volume magnetic susceptibilities of materials surrounding NMR sample to that of the solvent can reduce susceptibility broadening of magnetic resonance lines.
Processing for manufacturing applications
[edit]
Vespel can be processed by direct forming (DF) and isostatic molding (basic shapes – plates, rods and tubes). For prototype quantities, basic shapes are typically used for cost efficiency since tooling is quite expensive for DF parts. For large scale CNC production, DF parts are often used to reduce per part costs, at the expense of material properties which are inferior to those of isostatically produced basic shapes.[7]
Types
[edit]
For different applications, special formulations are blended/compounded. Shapes are produced by three standard processes:
compression molding (for plates and rings);
isostatic molding (for rods); and
direct forming (for small size parts produced in large volumes).
Direct-formed parts have lower performance characteristics than parts that have been machined from compression-molded or isostatic shapes. Isostatic shapes have isotropic physical properties, whereas direct formed and compression molded shapes exhibit anisotropic physical properties.
Some examples of standard polyimide compounds are:
SP-1 virgin polyimideprovides operating temperatures from cryogenic to 300 °C (570 °F), high plasma resistance, as well as a UL rating for minimal electrical and thermal conductivity. This is the unfilled base polyimide resin. It also provides high physical strength and maximal elongation, and the best electrical and thermal insulation values. Example: Vespel SP-1.15% graphite by weight, SP-21added to the base resin for increased wear resistance and reduced friction in applications such as plain bearings, thrust washers, seal rings, slide blocks and other wear applications. This compound has the best mechanical properties of the graphite-filled grades, but lower than the virgin grade. Example: Vespel SP-21.40% graphite by weight, SP-22for enhanced wear resistance, lower friction, improved dimensional stability (low coefficient of thermal expansion), and stability against oxidation. Example: Vespel SP-22.10% PTFE and 15% graphite by weight, SP-211added to the base resin for the lowest coefficient of friction over a wide range of operating conditions. It also has excellent wear resistance up to 149 °C (300 °F). Typical applications include sliding or linear bearings as well as many wear and friction uses listed above. Example: Vespel SP-211.15% moly-filled (molybdenum disulfide solid lubricant), SP-3for wear and friction resistance in vacuum and other moisture-free environments where graphite actually becomes abrasive. Typical applications include seals, plain bearings, gears, and other wear surfaces in outer space, ultra-high vacuum or dry gas applications. Example: Vespel SP-3.
Material properties data
[edit]
Material properties of Vespel[8] (produced by isostatic molding and machining)
Property Units Test
condition SP-1
(unfilled) SP-21
(15% graphite) SP-22
(40% graphite) SP-211
(10% PTFE,
15% graphite) SP-3
(15% MoS
2)
Specific gravity dimensionless 1.43 1.51 1.65 1.55 1.60
Thermal expansion
coefficient 10?6/K 211–296 K 45 34 27 [9]
296–573 K 54 49 38 54 52
Thermal conductivity W/mK at 313 K 0.35 0.87 1.73 0.76 0.47
Volume resistivity Ω·m at 296 K 1014–1015 1012–1013
Dielectric constant dimensionless at 100 Hz 3.62 13.53
at 10 kHz 3.64 13.28
at 1 MHz 3.55 13.87
在 条件下值得信赖
Vespel® 部件和型材适用于恶劣的工业操作环境
温度、高摩擦和重负荷?自 1965 年以来,在恶劣的条件下,Vespel® 的性能表现优于其他工程材料。
诸如航空航天部件,半导体加工,汽车制造和能源生产等要求苛刻的应用依靠 Vespel® 零件来保证其设备运行。
Vespel®聚酰亚胺材料可在低温至高温下连续运行; 在润滑或未润滑的环境中,在高 PV 下的低磨损和低摩擦; 优异的抗蠕变,高强度和抗冲击性; 出色的尺寸稳定性; 低热膨胀系数; 以及易加工性。
Vespel® 使零件重量更轻不仅切实可行,而且在许多情况下优于通用金属,陶瓷和其他工程聚合物,例如 PEEK(聚醚醚酮)和 PAI(聚酰胺-酰亚胺) )。
在亚洲、欧洲和美洲的设计中心,杜邦技术人员与客户一起合作,将材料科学与设计相结合,以生产高性能零件并保持生产平稳运行。
Vespel® 部件与型材(无论定制的还是常规规格)都经过测试,已在 苛刻的应用中经过测试并证明可靠。它们有板、棒、管、方块、长条、圆盘、环、圆球和定制机加工制件。[
用途
- 轴承、衬套、绝缘件、密封件、止推垫片和耐磨环
- 耐磨垫、耐磨条和管夹
- 热塑性注塑、装配和复合部件
- 测试插座和晶圆导轨
- 玻璃夹持技术
- 离心泵中的耐磨部件
- 碳氢化合物、化学品和给水泵
- 饮用水应用
优势
- 低蠕变和低释气
- 轻质但能承受高负荷
- 耐化学性、耐电气、耐磨损和耐热性
- 强度、刚性和尺寸稳定性
- 易于机加工,可加工至非常紧密的公差
- 在极限真空、辐射、氧气相容性、低温条件以及暴露于火焰的情况下行之有效
- 制造成本低于陶瓷